LYB offers fast and efficient prototypes assembly to reduce design cycle time, Contributes Design for Manufacturability (DFM) and Testability (DFT) recommendations to improve manufacturability of the product, which ultimately reduces time to market.
Our highly flexible Surface Mount Technology (SMT) lines, and our ability to quickly changeover or adapt - is designed to produce high quality, low volume, high mix, 0201, BGA, CCGA, CSP, QFP, small batch sizes. Our manufacturing model is designed for the unique needs of our customers.
LYB offer Automated Pin Through Hole Assembly, Hand Soldering, No-cleaning Processing Wave Soldering, Through Hole Assembly Services
We provide full coatings and encapsulation services to protect sensitive electronics from environmental hazards. When your electronics solutions need to perform in a rugged environment, whether for the aerospace, defense, medical, industrial or rail transportation industries.
Our range of IC programming Service include: MCU/MPU, EPROM, EEPROM, FLASH, Nand Flash, PLD/CPLD, SDCard, TFCard, CFCard, eMMC, eMMC, MoviNand, DIP / SDIP / SOP / MSOP / QSOP / SSOP / TSOP / TSSOP / PLCC / QFP / QFN / MLP / MLF / BGA / CSP / SOT / DFN
Our range of test capabilities include:Automated Test Equipment, Flying probe, AOI ( Automated Optical Inspection ), X-Ray, Burn-in ( temperature soak ), Mechanical fixturing、ICT ( in-circuit test ), Solder Paste Inspection, MDA ( manufacturing defect analysis ), In circuit functional test, Automated test software development, Manual, Electrical safety test, RF test ( radio-frequency ), Cable/Harness Test
For details of Fulltronics assembly workshop, please click here